Lumi · Laser Chip OEM Factory
Catering to high-speed communication, 3D sensing, consumer electronics, industrial, and automotive applications, we provide a comprehensive suite of end-to-end services—ranging from design support and MPW wafer services to testing, analysis, and packaging solutions—helping customers shorten product introduction cycles and enhance mass production efficiency
Photodetector
PD / APD / MPD
10G / 25G / 50G
800nm–2600nm
Meets the requirements of silicon photonics, communications, and sensing applications.
Edge-emitting laser
FP / DFB / EML
FP：10G / 25G / 100G / 200G
DFB：1310nm / 1550nm / 1650nm
EML：100G / 200G
Vertical-Cavity Surface-Emitting Laser
VCSEL
850nm 10G–200G
650nm–850nm / 905nm / 940nm
Consumer Electronics and 3D Sensing Applications
Application
Core Technological Advantages
Advanced Epitaxial Technology
• InP / GaAs Epitaxial Growth Platform
• Multiple Quantum Wells / Nano Structures / Butt-Joint Growth
• High Uniformity and Low Defect Density
Precision Process Manufacturing
• Oxidation / Etching / Thin-Film Processes
• Flip-Chip Long-Wavelength Packaging / Bonding Processes
• High-Precision Packaging and Mass Production Capability
Strict Testing & Reliability
• Wafer-Level and Device-Level Full Process Testing
• Aging Test / Low Noise / High Reliability
• Comprehensive Reliability Verification System
| Process Platform | Edge-Emitting Lasers （FP / DFB） |
Vertical-Cavity Surface-Emitting Lasers （VCSEL） |
Photodetectors （PD / APD / MPD） |
|---|---|---|---|
| Substrate Material | InP / GaAs | InP / GaAs | InP / GaAs |
| Epitaxial Material | AlGaInAs / InGaAsP / GaInP / InGaAs / InP / AlGaAs | GaAs / AlGaAs / InGaAs / InAlGaAs / GaAsP / AlGaAsP | InGaAs / InAlAs / AlGaAs / InGaAsP / InAlGaAs |
| Wafer Size | 75mm / 100mm | 75mm / 100mm / 150mm | 75mm / 100mm |
Three Specialized Process Platforms
Encompassing edge-emitting lasers, vertical-cavity surface-emitting lasers (VCSELs), and detector platforms, we provide a one-stop foundry solution ranging from design to mass production.
Edge-Emitting Laser Platform
Focused on edge-emitting laser devices for communication and sensing applications, with mature capabilities in epitaxial growth, grating design, and chip fabrication processes.
- • RWA Structure, BH Structure
• EBL Gain, CPW Electrodes
• ECR Thermal-Control Coating
• Butt-Coupled Integrated Structure
Vertical-Cavity Surface-Emitting Lasers (VCSELs)
Providing full-process VCSEL manufacturing technology, supporting the development of high-power and high-efficiency VCSEL products.
- • Wet Oxidation Process
• Vertical Etching Process
• Polarization VCSEL Grating Process
Photodetectors
Covering multiple photodetector process platforms, supporting the development and mass production of high-speed, high-sensitivity photodetector products.
- • Low-Temperature, High-Uniformity Zinc Diffusion Process Based on MOCVD
• APD Sidewall Passivation Process and BCB Planarization Process
• On-Wafer Bandwidth Testing (Up to 67 GHz)
Optoelectronic Epitaxy Process Platform
GaAs Series
905/940 nm Single-Junction / Multi-Junction VCSEL;10G / 25G VCSEL
InP Series
MPD, 10G / 25G / 56G PD;O-band / C-band 10G / 25G FP / DFB;EML, QCL;2.5G / 10G APD, SPAD;High-Power FP / SLD / SOA / DFB
Certification
